C12000 Oxygen Free Copper Details
C12000 oxygen-free copper is a high-performance copper alloy material, due to its excellent electrical conductivity, thermal conductivity and processing performance, has a wide range of applications in electronics, electrical, welding and other fields. The following will be from the material characteristics, production process, application areas, market status and development trends, etc., a comprehensive introduction to this material.
C12000 oxygen-free copper belongs to the phosphorus deoxygenation copper series, its core feature is the extremely low oxygen content (usually Less than or equal to 0.003%). By adding trace phosphorus (0.004%-0.012%) as a deoxidizer, the material significantly improves weldability and resistance to hydrogen embrittlement while maintaining high purity copper performance. Compared with ordinary pure copper, its typical properties are shown as:
1. **Electrical and thermal conductivity**: electrical conductivity up to 98% IACS or more, thermal conductivity of about 380W/(m-K), close to the theoretical value of pure copper;
2. Mechanical properties: annealed state tensile strength Greater than or equal to 200MPa, elongation Greater than or equal to 35%, cold working strength can be increased to more than 400MPa;
3. Process performance: excellent hot and cold processing molding properties, can be drawn into the diameter of 0.01mm below the ultra-fine wire material;
4. Special stability: in the reducing atmosphere will not occur "hydrogen disease" phenomenon, high temperature environment, oxidation resistance is outstanding.
The production of C12000 adopts the process chain of "vacuum melting - continuous casting and rolling", and the core technology links include:
1. raw material selection: copper cathode purity Greater than or equal to 99.99%, phosphorus additives need to be specially purified. 2. vacuum melting: in 10 minutes, the cathode is melted in a vacuum melting process;
2. vacuum melting: melting in 10^-3Pa vacuum environment, effectively controlling gas inclusions. 3. deoxidizing process: adopting the "Deoxidizing Process", which is the most effective way of deoxidizing copper cathodes;
3. deoxidizing process: using "phosphorus-copper intermediate alloy" to ensure the uniform distribution of phosphorus elements;
4. Continuous casting control: the application of electromagnetic stirring technology makes the grain size of cast billet reach ASTM 6 or above;
5. precision rolling: multi-channel rolling process makes the finished product thickness tolerance control in ± 0.001mm.
A leading enterprise adopts "horizontal continuous casting - planetary rolling" innovative process, so that 8mm billet rolled into 0.1mm strip, processing efficiency by 40%, reduce energy consumption by 25%.
1. electronic packaging: used as LED bracket, IC lead frame, a model of TO-220 packaging device using C12000, thermal resistance reduced by 18%;
2. power transmission: high-voltage vacuum switch contact materials, in the 40.5kV grade switch in the electric life of more than 100,000 times;
3. welding field: as melting electrode gas shielded welding (MIG welding) wire material, especially suitable for stainless steel dissimilar metal welding;
4. special cables: submarine fiber optic cable armor layer materials, in the 8,000-meter deep sea environment and still maintain stable performance;
5. new energy equipment: fuel cell bipolar plate coating substrate, so that the output power density of a single cell increased to 1.2W/cm².
According to industry statistics, in 2024, China's C12000 in the semiconductor field of the amount of year-on-year growth of 23%, of which the consumption of 12-inch wafer manufacturing equipment accounted for 37%.
1. Supply and demand pattern: the global annual production capacity of about 250,000 tons, mainly concentrated in Nippon Mining & Metals, Wieland, Chalco Luo Copper and other enterprises. Domestic high-end products are still dependent on imports, and the unit price of imports is 40-60% higher than that of domestic products;
2. price trend: 2024 Q4 spot price maintained at 78-85 yuan / kg, significantly affected by copper price fluctuations;
3. technical barriers: ultra-fine wire (diameter <0.03mm) of the filament breakage rate control is still the industry's difficulties, Japanese companies can do ≤ 0.5 times / million meters;
4. Alternative materials: copper-silver alloy (C15000) in some high-frequency scenarios to form competition, but the cost is higher than 30%.
1. microstructure control: through rare earth microalloying (such as adding 0.03% Ce) can make the recrystallization temperature by 50 degree ;
2. Composite development: copper - graphene composite materials R & D breakthroughs, laboratory samples conductivity increased by 12%;
3. Green manufacturing: direct electrolytic refining technology for copper scrap can reduce carbon emissions by 35%;
4. application expansion: in the quantum computer superconducting magnets, space radiation protection layer and other emerging fields began to trial.
The latest research of a scientific research institution shows that the fatigue life of C12000 components molded by selective laser melting (SLM) 3D printing reaches 92% of the traditional process products, which opens up a new path for the manufacture of complex structural components.
